MC9S12XDT256CAL
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NXP USA Inc. MC9S12XDT256CAL

Manufacturer No:
MC9S12XDT256CAL
Manufacturer:
NXP USA Inc.
Package:
Tray
Description:
IC MCU 16BIT 256KB FLASH 112LQFP
Delivery:
Payment:
iso14001
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Product Introduction

Overview

The MC9S12XDT256CAL is a 16-bit microcontroller from NXP USA Inc., part of the S12XD family. This microcontroller is designed to meet the demanding requirements of automotive and industrial applications, offering a balance between performance and efficiency. It features the HCS12X core, which provides 32-bit performance with the advantages of a 16-bit architecture.

The device is highly integrated, making it suitable for compact and efficient designs, particularly in applications such as three-phase motor control and automotive multiplexing.

Key Specifications

Specification Value
Microcontroller Type 16-bit HCS12X Core
Flash Memory 256 KB
Operating Frequency Up to 80 MHz
Package Type 112-Pin LQFP
Voltage Range 2.5V to 5.5V
Temperature Range -40°C to 125°C
Interface CAN, SPI, SCI, I2C, etc.

Key Features

  • High Performance: The HCS12X core provides 32-bit performance in a 16-bit architecture, ensuring efficient processing.
  • High Integration: Includes multiple peripherals such as CAN, SPI, SCI, I2C, and more, making it a comprehensive solution for various applications.
  • Compact Design: Available in a 112-Pin LQFP package, ideal for space-constrained designs.
  • Automotive Grade: Designed to meet the stringent requirements of automotive applications, including robust temperature and voltage specifications.
  • Low Power Consumption: Optimized for low power consumption, making it suitable for battery-powered and energy-efficient designs.

Applications

  • Automotive Systems: Ideal for automotive multiplexing, body control modules, and other automotive applications requiring high reliability and performance.
  • Industrial Control: Suitable for industrial control systems, including motor control, automation, and other industrial applications.
  • Three-Phase Motor Control: Compact and efficient solution for three-phase motor control applications.
  • Embedded Systems: Can be used in various embedded systems requiring high integration and performance.

Q & A

  1. What is the core architecture of the MC9S12XDT256CAL?

    The MC9S12XDT256CAL features a 16-bit HCS12X core.

  2. How much flash memory does the MC9S12XDT256CAL have?

    The device has 256 KB of flash memory.

  3. What is the maximum operating frequency of the MC9S12XDT256CAL?

    The maximum operating frequency is up to 80 MHz.

  4. In what package type is the MC9S12XDT256CAL available?

    The device is available in a 112-Pin LQFP package.

  5. What is the voltage range for the MC9S12XDT256CAL?

    The voltage range is from 2.5V to 5.5V.

  6. What are the typical applications for the MC9S12XDT256CAL?

    Typical applications include automotive systems, industrial control, three-phase motor control, and other embedded systems.

  7. Is the MC9S12XDT256CAL suitable for high-temperature environments?

    Yes, it operates in a temperature range of -40°C to 125°C.

  8. Does the MC9S12XDT256CAL support CAN communication?

    Yes, it includes a CAN interface among other communication peripherals.

  9. What are the advantages of using the HCS12X core in the MC9S12XDT256CAL?

    The HCS12X core provides 32-bit performance with the efficiency and advantages of a 16-bit architecture.

  10. Is the MC9S12XDT256CAL designed for low power consumption?

    Yes, it is optimized for low power consumption, making it suitable for energy-efficient designs.

Product Attributes

Core Processor:HCS12X
Core Size:16-Bit
Speed:80MHz
Connectivity:CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI
Peripherals:LVD, POR, PWM, WDT
Number of I/O:91
Program Memory Size:256KB (256K x 8)
Program Memory Type:Flash
EEPROM Size:4K x 8
RAM Size:16K x 8
Voltage - Supply (Vcc/Vdd):2.35V ~ 5.5V
Data Converters:A/D 16x10b
Oscillator Type:External
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:112-LQFP
Supplier Device Package:112-LQFP (20x20)
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Part Number MC9S12XDT256CAL MC9S12XDT256VAL MC9S12XDT256MAL MC9S12XD256CAL MC9S12XDT256CAA MC9S12XDT256CAG
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. Freescale Semiconductor
Product Status Active Active Active Active Active Obsolete
Core Processor HCS12X HCS12X HCS12X HCS12X HCS12X HCS12X
Core Size 16-Bit 16-Bit 16-Bit 16-Bit 16-Bit 16-Bit
Speed 80MHz 80MHz 80MHz 80MHz 80MHz 80MHz
Connectivity CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI CANbus, EBI/EMI, I²C, IrDA, LINbus, SCI, SPI
Peripherals LVD, POR, PWM, WDT LVD, POR, PWM, WDT LVD, POR, PWM, WDT LVD, POR, PWM, WDT LVD, POR, PWM, WDT LVD, POR, PWM, WDT
Number of I/O 91 91 91 91 59 119
Program Memory Size 256KB (256K x 8) 256KB (256K x 8) 256KB (256K x 8) 256KB (256K x 8) 256KB (256K x 8) 256KB (256K x 8)
Program Memory Type Flash Flash Flash Flash Flash Flash
EEPROM Size 4K x 8 4K x 8 4K x 8 4K x 8 4K x 8 4K x 8
RAM Size 16K x 8 16K x 8 16K x 8 14K x 8 16K x 8 16K x 8
Voltage - Supply (Vcc/Vdd) 2.35V ~ 5.5V 2.35V ~ 5.5V 2.35V ~ 5.5V 2.35V ~ 5.5V 2.35V ~ 5.5V 2.35V ~ 5.5V
Data Converters A/D 16x10b A/D 16x10b A/D 16x10b A/D 16x10b A/D 8x10b A/D 24x10b
Oscillator Type External External External External External External
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 105°C (TA) -40°C ~ 125°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 112-LQFP 112-LQFP 112-LQFP 112-LQFP 80-QFP 144-LQFP
Supplier Device Package 112-LQFP (20x20) 112-LQFP (20x20) 112-LQFP (20x20) 112-LQFP (20x20) 80-QFP (14x14) 144-LQFP (20x20)

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