MC33FS8530A0ESR2
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NXP USA Inc. MC33FS8530A0ESR2

Manufacturer No:
MC33FS8530A0ESR2
Manufacturer:
NXP USA Inc.
Package:
Tape & Reel (TR)
Description:
SYSTEM BASIS CHIP FS8500
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The MC33FS8530A0ESR2 is a safety power management IC developed by NXP Semiconductors. This component is designed to provide advanced power management capabilities, ensuring reliable and efficient operation in various applications. It is packaged in a HVQFN56 plastic thermal enhanced very thin quad flat package with no leads and wettable flanks, featuring 56 terminals. The IC is compliant with the latest environmental standards, including ROHS certification and the REACH directive, making it a green and environmentally friendly option.

Key Specifications

SpecificationValue
Package TypeHVQFN56
Number of Terminals56
Package DescriptionPlastic thermal enhanced very thin quad flat package; no leads; wettable flank
Environmental ComplianceROHS certified, REACH directive compliant

Key Features

  • Advanced power management capabilities
  • High reliability and efficiency
  • Compliant with latest environmental standards (ROHS and REACH)
  • Compact HVQFN56 package with 56 terminals

Applications

The MC33FS8530A0ESR2 is suitable for a variety of applications that require robust power management. These include automotive systems, industrial control systems, medical devices, and other high-reliability electronic systems where efficient and safe power management is critical.

Q & A

  1. What is the package type of the MC33FS8530A0ESR2? The package type is HVQFN56.
  2. How many terminals does the MC33FS8530A0ESR2 have? It has 56 terminals.
  3. Is the MC33FS8530A0ESR2 environmentally friendly? Yes, it is ROHS certified and compliant with the REACH directive.
  4. What are the key features of the MC33FS8530A0ESR2? It includes advanced power management capabilities, high reliability, and efficiency.
  5. What are some typical applications for the MC33FS8530A0ESR2? It is used in automotive systems, industrial control systems, medical devices, and other high-reliability electronic systems.
  6. Where can I find detailed specifications for the MC33FS8530A0ESR2? Detailed specifications can be found on NXP Semiconductors' official website and through distributors like Mouser Electronics.
  7. What is the significance of the HVQFN56 package? The HVQFN56 package is a compact and thermally enhanced package that improves heat dissipation and reduces the overall size of the component.
  8. Is the MC33FS8530A0ESR2 suitable for high-temperature applications? Yes, it is designed to operate in a variety of temperature conditions, making it suitable for high-temperature applications.
  9. Can I use the MC33FS8530A0ESR2 in automotive safety systems? Yes, it is designed to meet the stringent requirements of automotive safety systems.
  10. How do I ensure proper mounting of the MC33FS8530A0ESR2? Proper mounting involves following the wettable flank guidelines and ensuring good thermal contact.

Product Attributes

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$11.94
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