MC33FS8510D3ESR2
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NXP USA Inc. MC33FS8510D3ESR2

Manufacturer No:
MC33FS8510D3ESR2
Manufacturer:
NXP USA Inc.
Package:
Tape & Reel (TR)
Description:
FS8510
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The MC33FS8510D3ESR2 is a power management integrated circuit (PMIC) produced by NXP USA Inc. This component is designed to provide comprehensive power management solutions for various electronic systems. It is packaged in a 56-pin HVQFN (8x8 mm) package, making it suitable for applications where space efficiency is crucial.

Key Specifications

ParameterValue
Package Type56-HVQFN (8x8 mm)
Number of Pins56
ManufacturerNXP USA Inc.
Product CategoryPower Supplies PMIC

Key Features

  • Comprehensive power management capabilities
  • Compact 56-HVQFN (8x8 mm) package for space-efficient designs
  • Multiple power rails for versatile system power distribution
  • High efficiency and reliability in power supply applications

Applications

  • Automotive systems requiring robust power management
  • Industrial control and automation systems
  • Consumer electronics with multiple power requirements
  • Medical devices needing reliable power supply solutions

Q & A

  1. What is the package type of the MC33FS8510D3ESR2? The MC33FS8510D3ESR2 is packaged in a 56-HVQFN (8x8 mm) package.
  2. How many pins does the MC33FS8510D3ESR2 have? The MC33FS8510D3ESR2 has 56 pins.
  3. Who is the manufacturer of the MC33FS8510D3ESR2? The MC33FS8510D3ESR2 is manufactured by NXP USA Inc.
  4. What category does the MC33FS8510D3ESR2 belong to? The MC33FS8510D3ESR2 belongs to the Power Supplies PMIC category.
  5. What are some key features of the MC33FS8510D3ESR2? Key features include comprehensive power management, a compact package, multiple power rails, and high efficiency.
  6. In what types of applications is the MC33FS8510D3ESR2 commonly used? It is commonly used in automotive systems, industrial control and automation, consumer electronics, and medical devices.
  7. Where can I find detailed specifications for the MC33FS8510D3ESR2? Detailed specifications can be found on the NXP Semiconductors official website, as well as on distributor websites like Digi-Key and Mouser Electronics.
  8. What is the significance of the 'HVQFN' package type? The 'HVQFN' package type stands for High-Voltage Quad Flat No-Lead, indicating a package designed for high-voltage applications with no leads.
  9. How does the MC33FS8510D3ESR2 contribute to system reliability? The MC33FS8510D3ESR2 contributes to system reliability through its robust power management capabilities and high efficiency.
  10. Can the MC33FS8510D3ESR2 be used in space-constrained designs? Yes, the MC33FS8510D3ESR2 is suitable for space-constrained designs due to its compact 8x8 mm package.

Product Attributes

Applications:Automotive, Power Supplies
Current - Supply:- 
Voltage - Supply:60V
Operating Temperature:-40°C ~ 125°C (TA)
Mounting Type:Surface Mount, Wettable Flank
Package / Case:56-VFQFN Exposed Pad
Supplier Device Package:56-HVQFN (8x8)
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In Stock

$10.72
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