MC17XS6500CEKR2
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NXP USA Inc. MC17XS6500CEKR2

Manufacturer No:
MC17XS6500CEKR2
Manufacturer:
NXP USA Inc.
Package:
Tape & Reel (TR)
Description:
IC PWR SWITCH N-CHAN 1:1 32SOIC
Delivery:
Payment:
iso14001
iso45001
iso9001
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Product Introduction

Overview

The MC17XS6500CEKR2 is a high-performance power switch integrated circuit (IC) designed and manufactured by NXP USA Inc. This component is part of the Penta 17 mΩ high-side switch family, specifically tailored for automotive lighting applications. It combines advanced features such as high transient current capability, precise control over incandescent lamps and light-emitting diodes (LEDs), and robust safety mechanisms. Although the MC17XS6500CEKR2 is currently obsolete and no longer manufactured, it remains a significant example of NXP's SMARTMOS technology and its contributions to automotive electronics.

Key Specifications

Parameter Value Unit
Package Type SOIC 32 pins with exposed pad
Operating Temperature Range -40 °C to 125 °C °C
ON-Resistance (RDS(on)) 17 mΩ (Typical at TJ = 25 °C, VBAT > 12 V)
SPI Control Frequency 5.0 MHz MHz
Number of Channels 6
Battery Voltage Feedback Precision ±1.0% to ±2.2% (depending on VBAT range) %
Current Sense Reporting 1.0% to 2.0% (for 9.0 V < VBAT < 18 V) %

Key Features

  • Penta 17 mΩ High-Side Switches: High transient current capability and low ON-resistance for efficient power switching.
  • SPI Control: 16-bit 5.0 MHz SPI interface for controlling overcurrent profiles, channel control, PWM duty cycles, and fault reporting.
  • Output Current Monitoring: Programmable current sensing with synchronization signal and battery voltage feedback.
  • Safety and Robustness: Dynamic overcurrent threshold profile, thermal shutdown, prewarning, and fault reporting. The device enters a Fail operation mode if communication with the external microcontroller is lost, ensuring continued operation and protection.
  • Limp Home Mode and External Smart Power Switch Control: Enhanced functionality for maintaining system operation under fault conditions.
  • SMARTMOS Technology: Utilizes NXP's SMARTMOS technology for high performance and reliability).

Applications

The MC17XS6500CEKR2 is primarily designed for automotive lighting applications, including the control and diagnosis of incandescent lamps and LEDs. It is suitable for use in various automotive systems where high reliability, precision, and robustness are required. This includes headlight systems, taillight systems, and other automotive lighting solutions).

Q & A

  1. What is the MC17XS6500CEKR2?

    The MC17XS6500CEKR2 is a high-side switch integrated circuit designed for automotive lighting applications, featuring 17 mΩ ON-resistance and advanced control capabilities).

  2. What is the package type of the MC17XS6500CEKR2?

    The MC17XS6500CEKR2 is packaged in a SOIC 32 pins with an exposed pad).

  3. What is the operating temperature range of the MC17XS6500CEKR2?

    The operating temperature range is -40 °C to 125 °C).

  4. What is the SPI control frequency of the MC17XS6500CEKR2?

    The SPI control frequency is 5.0 MHz).

  5. How many channels does the MC17XS6500CEKR2 have?

    The MC17XS6500CEKR2 has 6 channels).

  6. What safety features does the MC17XS6500CEKR2 include?

    The device includes dynamic overcurrent threshold profile, thermal shutdown, prewarning, and fault reporting. It also enters a Fail operation mode if communication with the external microcontroller is lost).

  7. Is the MC17XS6500CEKR2 still in production?

    No, the MC17XS6500CEKR2 is obsolete and no longer manufactured).

  8. What technology does the MC17XS6500CEKR2 use?

    The MC17XS6500CEKR2 uses NXP's SMARTMOS technology).

  9. What are the primary applications of the MC17XS6500CEKR2?

    The primary applications are in automotive lighting systems, including the control and diagnosis of incandescent lamps and LEDs).

  10. How does the MC17XS6500CEKR2 handle communication loss with the external microcontroller?

    If communication with the external microcontroller is lost, the device enters a Fail operation mode but remains operational, controllable, and protected).

Product Attributes

Switch Type:General Purpose
Number of Outputs:6
Ratio - Input:Output:1:1
Output Configuration:High Side
Output Type:N-Channel
Interface:SPI
Voltage - Load:7V ~ 18V
Voltage - Supply (Vcc/Vdd):4.5V ~ 5.5V
Current - Output (Max):5.5A
Rds On (Typ):17mOhm
Input Type:- 
Features:Internal PWM
Fault Protection:Current Limiting (Fixed), Open Load Detect, Over Temperature
Operating Temperature:-40°C ~ 125°C (TA)
Mounting Type:Surface Mount
Supplier Device Package:32-SOIC-EP
Package / Case:32-SSOP (0.295", 7.50mm Width) Exposed Pad
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Similar Products

Part Number MC17XS6500CEKR2 MC17XS6500EKR2 MC17XS6500EEKR2 MC17XS6400CEKR2 MC17XS6500BEKR2
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Obsolete Obsolete Active Obsolete Obsolete
Switch Type General Purpose General Purpose General Purpose General Purpose General Purpose
Number of Outputs 6 6 6 5 6
Ratio - Input:Output 1:1 1:1 2:3 1:1 1:1
Output Configuration High Side High Side High Side High Side High Side
Output Type N-Channel N-Channel N-Channel N-Channel N-Channel
Interface SPI SPI SPI SPI SPI
Voltage - Load 7V ~ 18V 7V ~ 18V 7V ~ 18V 7V ~ 18V 7V ~ 18V
Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V 4.5V ~ 5.5V 4.5V ~ 5.5V 4.5V ~ 5.5V 4.5V ~ 5.5V
Current - Output (Max) 5.5A - 5.5A 5.5A 5.5A
Rds On (Typ) 17mOhm 17mOhm 17mOhm 17mOhm 17mOhm
Input Type - - - - -
Features Internal PWM Internal PWM Internal PWM Slew Rate Controlled Internal PWM
Fault Protection Current Limiting (Fixed), Open Load Detect, Over Temperature Current Limiting (Fixed), Open Load Detect, Over Temperature Current Limiting (Fixed), Open Load Detect, Over Temperature Current Limiting (Fixed), Open Load Detect, Over Temperature Current Limiting (Fixed), Open Load Detect, Over Temperature
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA) -40°C ~ 125°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Supplier Device Package 32-SOIC-EP 32-HSOP 32-HSOP 32-SOIC-EP 32-HSOP
Package / Case 32-SSOP (0.295", 7.50mm Width) Exposed Pad 32-SSOP (0.295", 7.50mm Width) Exposed Pad 32-SSOP (0.295", 7.50mm Width) Exposed Pad 32-SSOP (0.295", 7.50mm Width) Exposed Pad 32-SSOP (0.295", 7.50mm Width) Exposed Pad

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