LPC812M101JDH20129
  • Share:

NXP USA Inc. LPC812M101JDH20129

Manufacturer No:
LPC812M101JDH20129
Manufacturer:
NXP USA Inc.
Package:
Bulk
Description:
IC MCU 32BIT 16KB FLASH 20TSSOP
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The LPC812M101JDH20 is a 32-bit microcontroller from NXP USA Inc., based on the ARM Cortex-M0+ core. This microcontroller is part of the LPC81x family, which is designed to offer a blend of value and integration, making it an ideal choice for entry-level and 8-bit alternative MCU applications. It is supported by the MCUXpresso development environment, facilitating efficient development and debugging.

Key Specifications

ParameterSpecification
CoreARM Cortex-M0+
FrequencyUp to 30 MHz
Flash MemoryUp to 16 kB
SRAMUp to 4 kB
GPIO PinsUp to 18 General-Purpose I/O pins
InterfacesI2C, up to three USARTs, up to two SPI interfaces
TimerMultiple-channel multi-rate timer (MRT), State Configurable Timer/PWM (SCTimer/PWM)
Power ModesSleep, Deep-sleep, Power-down, Deep power-down
Operating Temperature-40 °C to 105 °C (except DIP8 package: -40 °C to 85 °C)
Package OptionsDIP8, TSSOP16, SO20, TSSOP20, XSON16

Key Features

  • High-speed GPIO interface with configurable pull-up/pull-down resistors, programmable open-drain mode, input inverter, and glitch filter.
  • High-current source and sink drivers (20 mA) on select pins.
  • Serial Wire Debug (SWD) and JTAG boundary scan modes supported.
  • Micro Trace Buffer (MTB) supported.
  • CRC engine and Windowed Watchdog timer (WWDT).
  • Integrated Power Management Unit (PMU) for reduced power consumption.
  • Flash In-Application Programming (IAP) and In-System Programming (ISP).
  • Unique device serial number for identification.

Applications

  • 8/16-bit applications.
  • Lighting control.
  • Consumer electronics.
  • Motor control.
  • Climate control.
  • Fire and security applications.

Q & A

  1. What is the core architecture of the LPC812M101JDH20? The LPC812M101JDH20 is based on the ARM Cortex-M0+ core.
  2. What is the maximum frequency of the LPC812M101JDH20? The maximum frequency is up to 30 MHz.
  3. How much flash and SRAM memory does the LPC812M101JDH20 have? It has up to 16 kB of flash memory and up to 4 kB of SRAM.
  4. What types of interfaces are supported by the LPC812M101JDH20? It supports I2C, up to three USARTs, and up to two SPI interfaces.
  5. What are the power modes available on the LPC812M101JDH20? The available power modes include Sleep, Deep-sleep, Power-down, and Deep power-down.
  6. What is the operating temperature range of the LPC812M101JDH20? The operating temperature range is -40 °C to 105 °C (except for the DIP8 package, which is -40 °C to 85 °C).
  7. What package options are available for the LPC812M101JDH20? It is available in DIP8, TSSOP16, SO20, TSSOP20, and XSON16 packages.
  8. Does the LPC812M101JDH20 support debug modes? Yes, it supports Serial Wire Debug (SWD) and JTAG boundary scan modes.
  9. What is the purpose of the Integrated Power Management Unit (PMU) in the LPC812M101JDH20? The PMU is designed to minimize power consumption.
  10. Can the LPC812M101JDH20 be programmed in-application? Yes, it supports Flash In-Application Programming (IAP) and In-System Programming (ISP).

Product Attributes

Core Processor:ARM® Cortex®-M0+
Core Size:32-Bit Single-Core
Speed:30MHz
Connectivity:I²C, SPI, UART/USART
Peripherals:Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:18
Program Memory Size:16KB (16K x 8)
Program Memory Type:Flash
EEPROM Size:- 
RAM Size:4K x 8
Voltage - Supply (Vcc/Vdd):1.8V ~ 3.6V
Data Converters:- 
Oscillator Type:Internal
Operating Temperature:-40°C ~ 105°C (TA)
Mounting Type:Surface Mount
Package / Case:20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package:20-TSSOP
0 Remaining View Similar

In Stock

-
574

Please send RFQ , we will respond immediately.

Same Series
RD15S10H00/AA
RD15S10H00/AA
CONN D-SUB RCPT 15POS CRIMP
DD15S2S5WV50
DD15S2S5WV50
CONN D-SUB HD RCPT 15P SLDR CUP
DD26M20LV5Z
DD26M20LV5Z
CONN D-SUB HD PLUG 26P SLDR CUP
RD15S10HT20/AA
RD15S10HT20/AA
CONN D-SUB RCPT 15POS CRIMP
DD26M20H00/AA
DD26M20H00/AA
CONN D-SUB HD PLUG 26P SLDR CUP
DD26S2000X/AA
DD26S2000X/AA
CONN D-SUB HD RCPT 26P SLDR CUP
CBC9W4S10HV5S/AA
CBC9W4S10HV5S/AA
CONN D-SUB RCPT 9POS CRIMP
DD26S2S50T2X/AA
DD26S2S50T2X/AA
CONN D-SUB HD RCPT 26P SLDR CUP
DD26S2S0V5X
DD26S2S0V5X
CONN D-SUB HD RCPT 26P SLDR CUP
DD26S2S0V3X/AA
DD26S2S0V3X/AA
CONN D-SUB HD RCPT 26P SLDR CUP
DD26S200V50
DD26S200V50
CONN D-SUB HD RCPT 26P SLDR CUP
DD44S3200T20
DD44S3200T20
CONN D-SUB HD RCPT 44P VERT SLDR

Similar Products

Part Number LPC812M101JDH20129 LPC812M101JD20129
Manufacturer NXP USA Inc. NXP USA Inc.
Product Status Active Active
Core Processor ARM® Cortex®-M0+ ARM® Cortex®-M0+
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 30MHz 30MHz
Connectivity I²C, SPI, UART/USART I²C, SPI, UART/USART
Peripherals Brown-out Detect/Reset, POR, PWM, WDT Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O 18 18
Program Memory Size 16KB (16K x 8) 16KB (16K x 8)
Program Memory Type Flash Flash
EEPROM Size - -
RAM Size 4K x 8 4K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V 1.8V ~ 3.6V
Data Converters - -
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 105°C (TA)
Mounting Type Surface Mount Surface Mount
Package / Case 20-TSSOP (0.173", 4.40mm Width) 20-SOIC (0.295", 7.50mm Width)
Supplier Device Package 20-TSSOP 20-SO

Related Product By Categories

LPC3240FET296/01K
LPC3240FET296/01K
NXP USA Inc.
IC MCU 16/32BIT ROMLESS 296TFBGA
STM32F303RBT6
STM32F303RBT6
STMicroelectronics
IC MCU 32BIT 128KB FLASH 64LQFP
STM32L422KBU6
STM32L422KBU6
STMicroelectronics
IC MCU 32BIT 128KB FLASH 32QFN
MSP430I2031TPWR
MSP430I2031TPWR
Texas Instruments
IC MCU 16BIT 32KB FLASH 28TSSOP
STM32F071V8T7
STM32F071V8T7
STMicroelectronics
IC MCU 32BIT 64KB FLASH 100LQFP
STM32G431RBI6
STM32G431RBI6
STMicroelectronics
IC MCU 32BIT 128KB FLASH 64UFBGA
LPC1313FBD48/01
LPC1313FBD48/01
NXP USA Inc.
IC MCU 32BIT 32KB FLASH 48LQFP
LPC2132FBD64/01118
LPC2132FBD64/01118
NXP USA Inc.
IC MCU 16/32BIT 64KB FLSH 64LQFP
MK10DX256VLK7R
MK10DX256VLK7R
NXP USA Inc.
IC MCU 32BIT 256KB FLASH 80FQFP
S9S12XS128J1MALR
S9S12XS128J1MALR
NXP USA Inc.
IC MCU 16BIT 128KB FLASH 112LQFP
FS32K142HRT0VLHT
FS32K142HRT0VLHT
NXP USA Inc.
IC MCU 32BIT 256KB FLASH 64LQFP
LPC1766FBD100,551
LPC1766FBD100,551
NXP USA Inc.
IC MCU 32BIT 256KB FLASH 100LQFP

Related Product By Brand

PMEG4030ER115
PMEG4030ER115
NXP USA Inc.
NOW NEXPERIA PMEG4030ER RECTIFIE
BUK7Y7R6-40E/GFX
BUK7Y7R6-40E/GFX
NXP USA Inc.
MOSFET N-CH LFPAK
A2T18H455W23NR6
A2T18H455W23NR6
NXP USA Inc.
AIRFAST RF POWER LDMOS TRANSISTO
MKE02Z64VQH4
MKE02Z64VQH4
NXP USA Inc.
IC MCU 32BIT 64KB FLASH 64QFP
LS1027AXE7PQA
LS1027AXE7PQA
NXP USA Inc.
LS1027A-1500 XT SEC
74HC4852D,112
74HC4852D,112
NXP USA Inc.
74HC4852D - DIFFERENTIAL MULTIP
UJA1075ATW/3V3WD,1
UJA1075ATW/3V3WD,1
NXP USA Inc.
IC INTFACE SPECIALIZED 32HTSSOP
74AHC244PW-Q100118
74AHC244PW-Q100118
NXP USA Inc.
BUS DRIVER, AHC/VHC/H/U/V SERIES
74LVC1G04GW/DG125
74LVC1G04GW/DG125
NXP USA Inc.
INVERTER, LVC/LCX/Z SERIES
MC34716EP
MC34716EP
NXP USA Inc.
IC REG CONV DDR 2OUT 26QFN
UJA1061TW/5V0/C/T518
UJA1061TW/5V0/C/T518
NXP USA Inc.
FAULT-TOLERANT CAN/LIN FAIL-SAFE
MKW36A512VFP4
MKW36A512VFP4
NXP USA Inc.
KINETIS W 32-BIT MCU ARM CORTEX-