LPC5536JBD100E
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NXP USA Inc. LPC5536JBD100E

Manufacturer No:
LPC5536JBD100E
Manufacturer:
NXP USA Inc.
Package:
Tray
Description:
IC MCU M33 256KB/128KB HLQFP100
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The LPC5536JBD100E is a 32-bit microcontroller from NXP USA Inc., part of the LPC553x family. It is based on the ARM Cortex-M33 core, which provides high-performance efficiency and advanced features for embedded applications. This microcontroller is designed to offer significant performance enhancements, intelligent peripherals, and advanced security features, making it suitable for a wide range of applications.

Key Specifications

Specification Details
Core ARM Cortex-M33 (r0p4)
Maximum Clock Frequency Up to 150 MHz
On-chip Flash Memory Up to 256 KB (246 KB available due to reserved space)
On-chip SRAM Up to 128 KB
Interfaces USB Full-Speed device and host, CAN FD, FlexSPI with cache, eight flexible serial communication peripherals (Flexcomm Interfaces), I3C interface, DMIC
Timers Five general-purpose timers, one SCTimer/PWM, one RTC/alarm timer, one 24-bit Multi-Rate Timer (MRT), Windowed Watchdog Timer (WWDT), Code Watchdog Timer, OS Timer, Micro-tick timer
ADC and DAC Four 16-bit ADCs (or four 12-bit ADCs at 3.2 Msamples/sec), three 12-bit DACs
Operating Voltage 1.8 V to 3.6 V (VDD_MAIN, VDD_CORE, VDDIO_1, VDDIO_2), separate VBAT supply 1.71 V to 3.6 V
Operating Temperature -40 °C to +105 °C
Package Options HLQFP100, HTQFP64, HVQFN48

Key Features

  • ARM Cortex-M33 Core: Includes integrated digital signal processing (DSP) instructions, Floating Point Unit (FPU), and Memory Protection Unit (MPU).
  • PowerQuad DSP Accelerator: For fixed and floating-point DSP functions, using a bank of four dedicated 4 KB SRAMs.
  • Low Power Modes: Sleep, Deep-sleep with RAM retention, power-down with RAM retention and CPU retention, and deep power-down with RAM retention.
  • Peripheral Wake-Up Options: Configurable wake-up options from peripherals interrupts, Micro-Tick Timer, and Real-Time Clock (RTC).
  • Advanced Peripherals: Includes FlexPWM timers, QEIs, comparators, temperature sensors, OpAmps, and more.
  • High-Speed Interfaces: USB Full-Speed device and host, CAN FD, FlexSPI with cache, and multiple serial communication interfaces.

Applications

The LPC5536JBD100E is versatile and can be used in various applications, including:

  • Industrial Automation: For control and monitoring systems due to its robust peripherals and low power consumption.
  • IoT Devices: Suitable for IoT applications requiring high performance, low power, and advanced security features.
  • Automotive Systems: Can be used in automotive applications due to its operating temperature range and robust peripheral set.
  • Consumer Electronics: Ideal for consumer electronics that require high-performance processing and advanced interfaces).

Q & A

  1. What is the core architecture of the LPC5536JBD100E?

    The LPC5536JBD100E is based on the ARM Cortex-M33 core.

  2. What is the maximum clock frequency of the LPC5536JBD100E?

    The maximum clock frequency is up to 150 MHz.

  3. How much on-chip flash and SRAM does the LPC5536JBD100E have?

    It has up to 256 KB of on-chip flash and up to 128 KB of on-chip SRAM.

  4. What types of interfaces does the LPC5536JBD100E support?

    It supports USB Full-Speed device and host, CAN FD, FlexSPI with cache, and multiple serial communication interfaces.

  5. What are the power modes available on the LPC5536JBD100E?

    The available power modes include Sleep, Deep-sleep with RAM retention, power-down with RAM retention and CPU retention, and deep power-down with RAM retention.

  6. What is the operating temperature range of the LPC5536JBD100E?

    The operating temperature range is -40 °C to +105 °C.

  7. What package options are available for the LPC5536JBD100E?

    The available package options are HLQFP100, HTQFP64, and HVQFN48.

  8. Does the LPC5536JBD100E support any specific wake-up options?

    Yes, it supports configurable wake-up options from peripherals interrupts, Micro-Tick Timer, and Real-Time Clock (RTC).

  9. What is the PowerQuad DSP accelerator in the LPC5536JBD100E?

    The PowerQuad DSP accelerator is for fixed and floating-point DSP functions, using a bank of four dedicated 4 KB SRAMs.

  10. What are some typical applications for the LPC5536JBD100E?

    Typical applications include industrial automation, IoT devices, automotive systems, and consumer electronics.

Product Attributes

Core Processor:ARM® Cortex®-M33
Core Size:32-Bit Single-Core
Speed:150MHz
Connectivity:CANbus, Flexcomm, I²C, I²S, I³C, SPI, UART/USART, USB2.0
Peripherals:DMA, PWM, WDT
Number of I/O:66
Program Memory Size:256KB (256K x 8)
Program Memory Type:Flash
EEPROM Size:- 
RAM Size:128K x 8
Voltage - Supply (Vcc/Vdd):1.8V ~ 3.6V
Data Converters:A/D 23x16b; D/A 2x12b
Oscillator Type:Internal
Operating Temperature:-40°C ~ 105°C (TA)
Mounting Type:Surface Mount
Package / Case:100-LQFP
Supplier Device Package:100-HLQFP (14x14)
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Similar Products

Part Number LPC5536JBD100E LPC5536JBD100K LPC5516JBD100E LPC5534JBD100E
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active Active
Core Processor ARM® Cortex®-M33 ARM® Cortex®-M33 ARM® Cortex®-M33 ARM® Cortex®-M33
Core Size 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core
Speed 150MHz 150MHz 150MHz 150MHz
Connectivity CANbus, Flexcomm, I²C, I²S, I³C, SPI, UART/USART, USB2.0 CANbus, Flexcomm, I²C, I²S, I³C, SPI, UART/USART, USB2.0 CANbus, Flexcomm, I²C, SPI, UART/USART, USB CANbus, Flexcomm, I²C, I²S, I³C, SPI, UART/USART, USB2.0
Peripherals DMA, PWM, WDT DMA, PWM, WDT Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT DMA, PWM, WDT
Number of I/O 66 66 64 66
Program Memory Size 256KB (256K x 8) 256KB (256K x 8) 256KB (256K x 8) 128KB (128K x 8)
Program Memory Type Flash Flash Flash Flash
EEPROM Size - - - -
RAM Size 128K x 8 128K x 8 96K x 8 96K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V 1.8V ~ 3.6V 1.8V ~ 3.6V 1.8V ~ 3.6V
Data Converters A/D 23x16b; D/A 2x12b A/D 23x16b; D/A 2x12b A/D 10x16b SAR A/D 23x16b; D/A 2x12b
Oscillator Type Internal Internal Internal Internal
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 100-LQFP 100-LQFP 100-LQFP Exposed Pad 100-LQFP
Supplier Device Package 100-HLQFP (14x14) 100-HLQFP (14x14) 100-HLQFP (14x14) 100-HLQFP (14x14)

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