LPC3143FET180,551
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NXP USA Inc. LPC3143FET180,551

Manufacturer No:
LPC3143FET180,551
Manufacturer:
NXP USA Inc.
Package:
Tray
Description:
IC MCU 16/32BIT ROMLESS 180TFBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
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Product Introduction

Overview

The NXP LPC3143FET180,551 is a highly integrated 32-bit microcontroller based on the ARM926EJ-S CPU core. This device is part of the LPC3100 series and is designed to offer a balance of high performance, low power consumption, and extensive peripheral support. It is particularly suited for applications in consumer, industrial, medical, and communication markets.

Key Specifications

SpecificationDetails
CPU Core270 MHz, 32-bit ARM926EJ-S
Cache16 kB D-cache and 16 kB I-cache
Internal Memory192 kB embedded SRAM
External Memory InterfaceNAND flash controller with 8-bit ECC and AES decryption support, 8/16-bit Multi-Port Memory Controller (MPMC): SDRAM and SRAM
SecurityAES decryption engine, Secure one-time programmable memory for AES key storage, 128 bit unique ID per device for DRM schemes
Communication and ConnectivityHigh-speed USB 2.0 (OTG, Host, Device) with on-chip PHY, Two I2S interfaces, Integrated master/slave SPI, Two master/slave I2C-bus interfaces, Fast UART, Memory Card Interface (MCI): MMC/SD/SDIO/CE-ATA
ADCFour-channel 10-bit ADC
Display InterfaceIntegrated 4/8/16-bit 6800/8080 compatible LCD interface
System FunctionsDynamic clock gating and scaling, Multiple power domains
Operating Voltage and TemperatureCore voltage: 1.2 V, I/O voltages: 1.8 V, 3.3 V, Temperature: -40°C to +85°C
PackageTFBGA180 package: 12 x 12 mm, 0.8 mm pitch

Key Features

  • CPU platform: 270 MHz, 32-bit ARM926EJ-S with MMU
  • Internal memory: 192 kB embedded SRAM
  • External memory interface: NAND flash controller with AES decryption support, 8/16-bit MPMC for SDRAM and SRAM
  • Security features: AES decryption engine, secure one-time programmable memory, 128 bit unique ID per device
  • Communication and connectivity: High-speed USB 2.0 OTG, I2S, SPI, I2C, Fast UART, MCI for MMC/SD/SDIO/CE-ATA
  • Analog peripherals: Four-channel 10-bit ADC
  • Display interface: Integrated 4/8/16-bit 6800/8080 compatible LCD interface
  • System functions: Dynamic clock gating and scaling, multiple power domains
  • General Purpose I/O pins (GPIO), flexible and versatile interrupt structure, JTAG interface with boundary scan and ARM debug access

Applications

The NXP LPC3143FET180,551 is versatile and can be used in a variety of applications, including:

  • Consumer electronics: Smart home devices, multimedia systems
  • Industrial control: Automation, monitoring systems
  • Medical devices: Diagnostic equipment, patient monitoring systems
  • Communication systems: Networking devices, wireless communication modules

Q & A

  1. What is the CPU core of the LPC3143FET180,551?
    The CPU core is a 270 MHz, 32-bit ARM926EJ-S.
  2. How much internal SRAM does the LPC3143FET180,551 have?
    The device has 192 kB of embedded SRAM.
  3. What security features does the LPC3143FET180,551 offer?
    The device includes an AES decryption engine, secure one-time programmable memory for AES key storage, and a 128 bit unique ID per device for DRM schemes.
  4. What types of memory interfaces are supported by the LPC3143FET180,551?
    The device supports NAND flash controller with AES decryption, and an 8/16-bit Multi-Port Memory Controller (MPMC) for SDRAM and SRAM.
  5. What are the operating voltage and temperature ranges of the LPC3143FET180,551?
    The core voltage is 1.2 V, I/O voltages are 1.8 V and 3.3 V, and the operating temperature range is -40°C to +85°C.
  6. What package type is the LPC3143FET180,551 available in?
    The device is available in a TFBGA180 package: 12 x 12 mm, 0.8 mm pitch.
  7. Does the LPC3143FET180,551 support high-speed USB?
    Yes, it supports high-speed USB 2.0 (OTG, Host, Device) with an on-chip PHY.
  8. What analog peripherals are available on the LPC3143FET180,551?
    The device includes a four-channel 10-bit ADC.
  9. What display interface does the LPC3143FET180,551 support?
    The device supports an integrated 4/8/16-bit 6800/8080 compatible LCD interface.
  10. What system functions are available for power management?
    The device features dynamic clock gating and scaling, and multiple power domains.

Product Attributes

Core Processor:ARM926EJ-S
Core Size:16/32-Bit
Speed:270MHz
Connectivity:EBI/EMI, I²C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG
Peripherals:DMA, I²S, LCD, PWM, WDT
Number of I/O:20
Program Memory Size:- 
Program Memory Type:ROMless
EEPROM Size:- 
RAM Size:192K x 8
Voltage - Supply (Vcc/Vdd):1.1V ~ 3.6V
Data Converters:A/D 4x10b
Oscillator Type:External
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:180-TFBGA
Supplier Device Package:180-TFBGA (12x12)
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IC MCU 16/32BIT ROMLESS 180TFBGA

Similar Products

Part Number LPC3143FET180,551 LPC3141FET180,551
Manufacturer NXP USA Inc. NXP USA Inc.
Product Status Not For New Designs Obsolete
Core Processor ARM926EJ-S ARM926EJ-S
Core Size 16/32-Bit 16/32-Bit
Speed 270MHz 270MHz
Connectivity EBI/EMI, I²C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG EBI/EMI, I²C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG
Peripherals DMA, I²S, LCD, PWM, WDT DMA, I²S, LCD, PWM, WDT
Number of I/O 20 20
Program Memory Size - -
Program Memory Type ROMless ROMless
EEPROM Size - -
RAM Size 192K x 8 192K x 8
Voltage - Supply (Vcc/Vdd) 1.1V ~ 3.6V 1.1V ~ 3.6V
Data Converters A/D 4x10b A/D 4x10b
Oscillator Type External External
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
Package / Case 180-TFBGA 180-TFBGA
Supplier Device Package 180-TFBGA (12x12) 180-TFBGA (12x12)

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