LPC2929FBD144,551
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NXP USA Inc. LPC2929FBD144,551

Manufacturer No:
LPC2929FBD144,551
Manufacturer:
NXP USA Inc.
Package:
Tray
Description:
IC MCU 16/32B 768KB FLSH 144LQFP
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The LPC2929FBD144,551 is a high-performance microcontroller from NXP USA Inc., part of the LPC2926/2927/2929 family. This microcontroller is based on the ARM968E-S CPU core and is designed to meet the demands of various applications in consumer, industrial, and communication markets. It features advanced peripherals and memory configurations, making it a versatile choice for complex system designs.

Key Specifications

Specification Details
CPU Core ARM968E-S
Maximum Frequency Up to 125 MHz
Flash Memory 768 kB
SRAM 56 kB + 2 x 32 kB TCM (Tightly Coupled Memory)
Package Type LQFP-144 (144 leads, body 20 x 20 x 1.4 mm)
USB Interface Full-speed USB 2.0 OTG and device controller
CAN and LIN Interfaces Yes, multiple CAN and LIN interfaces
ADCs Three 10-bit ADCs
Serial and Parallel Interfaces Multiple serial and parallel interfaces

Key Features

  • ARM968E-S Processor: Runs at frequencies up to 125 MHz with real-time emulation support.
  • Multi-layer AHB System Bus: Operates at 125 MHz with four separate layers.
  • On-chip Memory: Includes two Tightly Coupled Memories (TCM), 32 kB Instruction TCM (ITCM), and 32 kB Data TCM (DTCM), along with two separate internal Static RAM (SRAM) instances.
  • USB and Communication Interfaces: Full-speed USB 2.0 OTG and device controller, multiple CAN and LIN interfaces, and multiple serial and parallel interfaces.
  • Power Management: Features a flexible Clock Generation Unit (CGU) for dynamic clock gating and scaling to optimize system power consumption.
  • ADCs and Peripherals: Three 10-bit ADCs and various other peripherals such as timers, PWM, and GPIO.

Applications

The LPC2929FBD144,551 is targeted at a wide range of applications, including:

  • Consumer Electronics: Devices requiring high-performance processing and multiple interfaces.
  • Industrial Automation: Systems needing robust communication protocols like CAN and LIN.
  • Communication Systems: Applications requiring full-speed USB and multiple serial interfaces.

Q & A

  1. What is the CPU core of the LPC2929FBD144,551?

    The CPU core is the ARM968E-S.

  2. What is the maximum operating frequency of the LPC2929FBD144,551?

    The maximum operating frequency is up to 125 MHz.

  3. How much flash memory does the LPC2929FBD144,551 have?

    The LPC2929FBD144,551 has 768 kB of flash memory.

  4. What type of package does the LPC2929FBD144,551 come in?

    The package type is LQFP-144 with 144 leads.

  5. Does the LPC2929FBD144,551 support USB?

    Yes, it supports full-speed USB 2.0 OTG and device controller.

  6. What communication interfaces are available on the LPC2929FBD144,551?

    The microcontroller includes multiple CAN and LIN interfaces.

  7. How many ADCs does the LPC2929FBD144,551 have?

    The LPC2929FBD144,551 has three 10-bit ADCs.

  8. What is the purpose of the Clock Generation Unit (CGU) in the LPC2929FBD144,551?

    The CGU provides dynamic clock gating and scaling to optimize system power consumption.

  9. In which markets is the LPC2929FBD144,551 primarily used?

    The LPC2929FBD144,551 is used in consumer, industrial, and communication markets.

  10. What are some of the key peripherals available on the LPC2929FBD144,551?

    The microcontroller includes timers, PWM, GPIO, and multiple serial and parallel interfaces.

Product Attributes

Core Processor:ARM9®
Core Size:16/32-Bit
Speed:125MHz
Connectivity:CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB
Peripherals:DMA, POR, PWM, WDT
Number of I/O:104
Program Memory Size:768KB (768K x 8)
Program Memory Type:Flash
EEPROM Size:16K x 8
RAM Size:56K x 8
Voltage - Supply (Vcc/Vdd):1.71V ~ 3.6V
Data Converters:A/D 24x10b
Oscillator Type:Internal
Operating Temperature:-40°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:144-LQFP
Supplier Device Package:144-LQFP (20x20)
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Same Series
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LPC2926FBD144,551
IC MCU 16/32B 256KB FLSH 144LQFP
LPC2927FBD144,551
LPC2927FBD144,551
IC MCU 16/32B 512KB FLSH 144LQFP

Similar Products

Part Number LPC2929FBD144,551 LPC2919FBD144,551 LPC2926FBD144,551 LPC2927FBD144,551
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Not For New Designs Obsolete Not For New Designs Obsolete
Core Processor ARM9® ARM9® ARM9® ARM9®
Core Size 16/32-Bit 16/32-Bit 16/32-Bit 16/32-Bit
Speed 125MHz 80MHz 125MHz 125MHz
Connectivity CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB CANbus, EBI/EMI, LINbus, SPI, UART/USART CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB
Peripherals DMA, POR, PWM, WDT POR, PWM, WDT DMA, POR, PWM, WDT DMA, POR, PWM, WDT
Number of I/O 104 108 104 104
Program Memory Size 768KB (768K x 8) 768KB (768K x 8) 256KB (256K x 8) 512KB (512K x 8)
Program Memory Type Flash Flash Flash Flash
EEPROM Size 16K x 8 - 16K x 8 16K x 8
RAM Size 56K x 8 80K x 8 56K x 8 56K x 8
Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V 1.71V ~ 3.6V 1.71V ~ 3.6V 1.71V ~ 3.6V
Data Converters A/D 24x10b A/D 16x10b A/D 24x10b A/D 24x10b
Oscillator Type Internal Internal Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 144-LQFP 144-LQFP 144-LQFP 144-LQFP
Supplier Device Package 144-LQFP (20x20) 144-LQFP (20x20) 144-LQFP (20x20) 144-LQFP (20x20)

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