EPM1270F256C5NAB
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Intel EPM1270F256C5NAB

Manufacturer No:
EPM1270F256C5NAB
Manufacturer:
Intel
Package:
Tray
Description:
IC CPLD 980MC 6.2NS 256FBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
iso13485

Product Introduction

Overview

The EPM1270F256C5NAB is a member of the MAX II family of instant-on, non-volatile Complex Programmable Logic Devices (CPLDs) produced by Intel (formerly Altera Corporation). This device is built on a 0.18-µm, 6-layer-metal-flash process and is known for its high performance and versatility. The MAX II CPLDs are designed to provide instant-on functionality, making them ideal for a wide range of applications that require rapid system startup and low power consumption.

Key Specifications

ParameterValue
Device TypeInstant-on, Non-volatile CPLD
Logic Elements1,270
Maximum User I/O Pins212
Package Type256-Pin FineLine BGA
Core Voltage1.8 V (internal), supports external 3.3 V, 2.5 V, or 1.8 V
I/O Voltage3.3 V, 2.5 V, 1.8 V, and 1.5 V
Maximum Clock Frequency304 MHz
Pin-to-Pin Delay (tPD1)6.2 ns
UFM SizeUp to 8 Kbits

Key Features

  • Provides four global clocks with two clocks available per logic array block (LAB)
  • Includes a UFM block up to 8 Kbits for non-volatile storage
  • MultiVolt core and I/O interface supporting various external supply voltages and logic levels
  • Bus-friendly architecture with programmable slew rate, drive strength, bus-hold, and programmable pull-up resistors
  • Schmitt triggers for noise-tolerant inputs
  • Compliant with PCI Local Bus Specification, Revision 2.2 for 3.3-V operation at 66 MHz
  • Supports hot-socketing and JTAG boundary-scan test (BST) circuitry compliant with IEEE Std. 1149.1-1990
  • In-system programmability (ISP) compliant with IEEE Std. 1532

Applications

The EPM1270F256C5NAB is suitable for a variety of applications, including:

  • High-speed data processing and communication systems
  • Embedded systems requiring rapid system startup and low power consumption
  • Industrial control systems and automation
  • Consumer electronics and appliances
  • Aerospace and defense systems where reliability and performance are critical

Q & A

  1. What is the EPM1270F256C5NAB used for? The EPM1270F256C5NAB is used in various applications requiring high performance, rapid system startup, and low power consumption, such as high-speed data processing, embedded systems, industrial control, and consumer electronics.
  2. What is the logic element count of the EPM1270F256C5NAB? The device has 1,270 logic elements.
  3. What package type does the EPM1270F256C5NAB come in? It comes in a 256-Pin FineLine BGA package.
  4. What are the supported core and I/O voltages for the EPM1270F256C5NAB? The device supports core voltages of 1.8 V internally and external supply voltages of 3.3 V, 2.5 V, or 1.8 V. The I/O interface supports 3.3 V, 2.5 V, 1.8 V, and 1.5 V logic levels.
  5. What is the maximum clock frequency of the EPM1270F256C5NAB? The maximum clock frequency is 304 MHz.
  6. Does the EPM1270F256C5NAB support hot-socketing? Yes, it supports hot-socketing.
  7. Is the EPM1270F256C5NAB compliant with any industry standards? Yes, it is compliant with PCI Local Bus Specification, Revision 2.2 for 3.3-V operation at 66 MHz and supports JTAG boundary-scan test (BST) circuitry and ISP compliant with IEEE standards.
  8. What is the UFM size of the EPM1270F256C5NAB? The UFM size is up to 8 Kbits.
  9. Can the EPM1270F256C5NAB be programmed in-system? Yes, it supports in-system programmability (ISP) compliant with IEEE Std. 1532.
  10. What are the key features of the bus-friendly architecture of the EPM1270F256C5NAB? The bus-friendly architecture includes programmable slew rate, drive strength, bus-hold, and programmable pull-up resistors.

Product Attributes

Programmable Type:In System Programmable
Delay Time tpd(1) Max:10 ns
Voltage Supply - Internal:2.375V ~ 2.625V, 3V ~ 3.6V
Number of Logic Elements/Blocks:1270
Number of Macrocells:980
Number of Gates:- 
Number of I/O:212
Operating Temperature:0°C ~ 85°C (TJ)
Mounting Type:Surface Mount
Package / Case:256-BGA
Supplier Device Package:256-FBGA (17x17)
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