The new high-current chokes use a novel alloy powder core material with superior saturation properties to push the boundaries of current density.… [Read more]
The new Snapdragon X Plus 8-core is designed to uphold high-performance standards while extending battery life by multiple days on Copilot+ PCs.… [Read more]
Infineon Technologies AG of Munich, Germany has developed what it says is the first 300mm power gallium nitride (GaN) wafer technology to be applied in an existing and scalable high-volume manufacturing environment.… [Read more]
The 14-bit scope combines architectural improvements and software support for higher resolution, real-time processing, and enhanced signal analysis.… [Read more]
Teams across Intel ‘turned over every rock’ to build the Intel Core Ultra 200V processor family, meeting laptop buyers’ demands for more endurance, more speed and new capabilities.… [Read more]
Since 2015, ROHM and UAES have been collaborating and conducting technical exchanges on automotive applications utilizing SiC power devices.… [Read more]
