The new line operates at 200 MHz—the highest dsPIC clock speed to date—and adds a double-precision floating point unit and enhanced DSP engine.… [Read more]
The ready-to-use circular board reference design puts 750 W drive capability into a circular PCB just 50 mm (1.9”) in diameter.… [Read more]
Two major trends are driving the demand for semiconductors in modern vehicles. First, EVs demand high-efficiency, high-performance power devices that can withstand the demands of the automotive environment.… [Read more]
Global energy demands are projected to soar over the next decade, making the need for increased power density in semiconductors paramount.… [Read more]
Teledyne e2v’s chips target space-based applications with significantly improved performance, protection against radiation, and spatial efficiency.… [Read more]
The new oscillator chip delivers low power consumption and ±20 ppm frequency stability to small IoT devices in a 1.2 mm x 1.1 mm QFN package… [Read more]
