66AK2L06XCMSA2
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Texas Instruments 66AK2L06XCMSA2

Manufacturer No:
66AK2L06XCMSA2
Manufacturer:
Texas Instruments
Package:
Tray
Description:
IC DSP ARM SOC 900FCBGA
Delivery:
Payment:
iso14001
iso45001
iso9001
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Product Introduction

Overview

The 66AK2L06XCMSA2 is a Multicore DSP+ARM KeyStone II System-on-Chip (SoC) produced by Texas Instruments. This advanced SoC integrates multiple processing cores, including ARM Cortex-A15 and TMS320C66x digital signal processors (DSPs), to provide high-performance processing capabilities. It is designed to support a wide range of applications that require intense computational power, such as telecommunications, medical imaging, and industrial automation.

Key Specifications

ParameterValue
Package Type900-FCBGA
Operating Temperature-40°C to 100°C
Processing CoresARM Cortex-A15, TMS320C66x DSP
Clock SpeedUp to 1.4 GHz (ARM), Up to 1.2 GHz (DSP)
MemorySupports various external memory interfaces including DDR3, DDR3L, and LPDDR3
InterfacesPCIe, Gigabit Ethernet, USB, SATA, and more

Key Features

  • High-performance processing with integrated ARM Cortex-A15 and TMS320C66x DSP cores.
  • Support for multiple operating systems including SYS/BIOS RTOS and Linux.
  • Advanced power management and low power consumption.
  • Comprehensive set of peripherals and interfaces such as PCIe, Gigabit Ethernet, USB, and SATA.
  • Highly optimized software development kits (MCSDK) for efficient development.

Applications

  • Telecommunications: Baseband processing, radio access networks.
  • Medical Imaging: MRI, CT scans, and other medical imaging applications.
  • Industrial Automation: Control systems, data acquisition, and processing.
  • Networking: Routers, switches, and network appliances.
  • Aerospace and Defense: Radar systems, signal processing.

Q & A

  1. What is the 66AK2L06XCMSA2? The 66AK2L06XCMSA2 is a Multicore DSP+ARM KeyStone II System-on-Chip (SoC) produced by Texas Instruments.
  2. What processing cores does it include? It includes ARM Cortex-A15 and TMS320C66x DSP cores.
  3. What is the operating temperature range of the 66AK2L06XCMSA2? The operating temperature range is -40°C to 100°C.
  4. What types of memory does it support? It supports various external memory interfaces including DDR3, DDR3L, and LPDDR3.
  5. What are some of the key interfaces available on this SoC? Key interfaces include PCIe, Gigabit Ethernet, USB, SATA, and more.
  6. Which operating systems are supported by the 66AK2L06XCMSA2? It supports SYS/BIOS RTOS and Linux.
  7. What are some common applications for the 66AK2L06XCMSA2? Common applications include telecommunications, medical imaging, industrial automation, networking, and aerospace and defense.
  8. What is the purpose of the MCSDK for this SoC? The MCSDK provides highly-optimized bundles of foundational, platform-specific drivers to enable efficient development on the SoC.
  9. What is the package type of the 66AK2L06XCMSA2? The package type is 900-FCBGA.
  10. What is the clock speed of the ARM and DSP cores? The ARM core can operate up to 1.4 GHz, and the DSP core can operate up to 1.2 GHz.

Product Attributes

Type:DSP+ARM®
Interface:EBI/EMI, Ethernet, DMA, I²C, PCIe, SPI, UART/USART, USB 3.0, USIM
Clock Rate:1.2GHz
Non-Volatile Memory:ROM (384kB)
On-Chip RAM:5.384MB
Voltage - I/O:0.85V, 1.0V, 1.8V, 3.3V
Voltage - Core:Variable
Operating Temperature:-40°C ~ 100°C (TC)
Mounting Type:Surface Mount
Package / Case:900-BFBGA, FCBGA
Supplier Device Package:900-FCBGA (25x25)
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Similar Products

Part Number 66AK2L06XCMSA2 66AK2L06XCMS2 66AK2L06XCMSA
Manufacturer Texas Instruments Texas Instruments Texas Instruments
Product Status Active Active Active
Type DSP+ARM® DSP+ARM® DSP+ARM®
Interface EBI/EMI, Ethernet, DMA, I²C, PCIe, SPI, UART/USART, USB 3.0, USIM EBI/EMI, Ethernet, DMA, I²C, PCIe, SPI, UART/USART, USB 3.0, USIM EBI/EMI, Ethernet, DMA, I²C, PCIe, SPI, UART/USART, USB 3.0, USIM
Clock Rate 1.2GHz 1.2GHz 1GHz
Non-Volatile Memory ROM (384kB) ROM (384kB) ROM (384kB)
On-Chip RAM 5.384MB 5.384MB 5.384MB
Voltage - I/O 0.85V, 1.0V, 1.8V, 3.3V 0.85V, 1.0V, 1.8V, 3.3V 0.85V, 1.0V, 1.8V, 3.3V
Voltage - Core Variable Variable Variable
Operating Temperature -40°C ~ 100°C (TC) 0°C ~ 100°C (TC) -40°C ~ 100°C (TC)
Mounting Type Surface Mount Surface Mount Surface Mount
Package / Case 900-BFBGA, FCBGA 900-BFBGA, FCBGA 900-BFBGA, FCBGA
Supplier Device Package 900-FCBGA (25x25) 900-FCBGA (25x25) 900-FCBGA (25x25)

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