LPC55S04JBD64E
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NXP USA Inc. LPC55S04JBD64E

Manufacturer No:
LPC55S04JBD64E
Manufacturer:
NXP USA Inc.
Package:
Tray
Description:
IC MCU 32BIT 128KB FLASH 64HTQFP
Delivery:
Payment:
iso14001
iso45001
iso9001
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Product Introduction

Overview

The LPC55S04JBD64E is a 32-bit microcontroller from NXP Semiconductors, based on the ARM Cortex-M33 core. This microcontroller is designed for embedded applications and offers a robust set of features that enhance security, performance, and flexibility. It includes advanced cryptographic engines, secure boot mechanisms, and a variety of peripherals to support diverse application needs.

Key Specifications

SpecificationDetails
Data Bus Width32 bit
Maximum Clock Frequency96 MHz
On-chip Flash MemoryUp to 256 KB
On-chip SRAMUp to 96 KB
ADC Resolution16 bit, 2.0 Msamples/sec
Number of I/Os45
Operating Voltage1.8 V to 3.6 V
Operating Temperature Range-40 °C to +105 °C
Package TypeHTQFP64

Key Features

  • ARM Cortex-M33 Core: Provides a secure foundation with TrustZone technology for IP and data protection.
  • Cryptographic Engines: Includes CASPER Crypto engine, PRINCE module for on-the-fly flash encryption/decryption, AES, PUF, SHA, and CRC.
  • Peripherals: Nine flexible serial communication peripherals (USART, SPI, I2C, I2S), CAN FD, five general-purpose timers, SCTimer/PWM, RTC/alarm timer, 24-bit Multi-Rate Timer (MRT), and Windowed Watchdog Timer (WWDT).
  • Programmable Logic Unit (PLU): Enhances system flexibility.
  • Temperature Sensor and Comparator: Integrated for various sensing applications.
  • DMA Controllers: DMA0 with 23 channels and DMA1 with 10 channels, supporting multiple triggers and memory access.

Applications

The LPC55S04JBD64E is suitable for a wide range of embedded applications, including:

  • Industrial Control Systems: Utilizing its robust peripherals and cryptographic features for secure communication and data processing.
  • Automotive Systems: Leveraging CAN FD and other automotive-specific features.
  • IoT Devices: Benefiting from its low power consumption, secure boot, and advanced cryptographic capabilities.
  • Medical Devices: Using its precise timing and sensing capabilities for medical applications.

Q & A

  1. What is the core architecture of the LPC55S04JBD64E?
    The LPC55S04JBD64E is based on the 32-bit ARM Cortex-M33 core.
  2. What is the maximum clock frequency of the LPC55S04JBD64E?
    The maximum clock frequency is 96 MHz.
  3. How much on-chip flash and SRAM does the LPC55S04JBD64E have?
    It has up to 256 KB of on-chip flash and up to 96 KB of on-chip SRAM.
  4. What cryptographic engines are included in the LPC55S04JBD64E?
    The device includes CASPER Crypto engine, PRINCE module, AES, PUF, SHA, and CRC.
  5. What is the operating voltage range of the LPC55S04JBD64E?
    The operating voltage range is 1.8 V to 3.6 V.
  6. What is the operating temperature range of the LPC55S04JBD64E?
    The operating temperature range is -40 °C to +105 °C.
  7. What package types are available for the LPC55S04JBD64E?
    The device is available in HTQFP64 and HVQFN48 packages.
  8. Does the LPC55S04JBD64E support CAN FD?
    Yes, it supports CAN FD.
  9. What is the resolution of the ADC in the LPC55S04JBD64E?
    The ADC resolution is 16 bits with a sampling rate of 2.0 Msamples/sec.
  10. Does the LPC55S04JBD64E have a Programmable Logic Unit (PLU)?
    Yes, it includes a Programmable Logic Unit (PLU).

Product Attributes

Core Processor:ARM® Cortex®-M33
Core Size:32-Bit Single-Core
Speed:96MHz
Connectivity:CANbus, Flex COMM, I²C, SPI, UART/USART
Peripherals:Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Number of I/O:45
Program Memory Size:128KB (128K x 8)
Program Memory Type:Flash
EEPROM Size:- 
RAM Size:80K x 8
Voltage - Supply (Vcc/Vdd):1.8V ~ 3.6V
Data Converters:A/D 9x16b SAR
Oscillator Type:Internal
Operating Temperature:-40°C ~ 105°C (TA)
Mounting Type:Surface Mount
Package / Case:64-TQFP Exposed Pad
Supplier Device Package:64-HTQFP (10x10)
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Similar Products

Part Number LPC55S04JBD64E LPC55S14JBD64E LPC55S06JBD64E LPC5504JBD64E
Manufacturer NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Product Status Active Active Active Active
Core Processor ARM® Cortex®-M33 ARM® Cortex®-M33 ARM® Cortex®-M33 ARM® Cortex®-M33
Core Size 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core
Speed 96MHz 150MHz 96MHz 96MHz
Connectivity CANbus, Flex COMM, I²C, SPI, UART/USART CANbus, Flexcomm, I²C, SPI, UART/USART, USB CANbus, Flex COMM, I²C, SPI, UART/USART CANbus, Flex COMM, I²C, SPI, UART/USART
Peripherals Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Number of I/O 45 36 45 45
Program Memory Size 128KB (128K x 8) 128KB (128K x 8) 256KB (256K x 8) 128KB (128K x 8)
Program Memory Type Flash Flash Flash Flash
EEPROM Size - - - -
RAM Size 80K x 8 80K x 8 96K x 8 80K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V 1.8V ~ 3.6V 1.8V ~ 3.6V 1.8V ~ 3.6V
Data Converters A/D 9x16b SAR A/D 10x16b SAR A/D 9x16b SAR A/D 9x16b SAR
Oscillator Type Internal Internal Internal Internal
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 64-TQFP Exposed Pad 64-TQFP Exposed Pad 64-TQFP Exposed Pad 64-TQFP Exposed Pad
Supplier Device Package 64-HTQFP (10x10) 64-HTQFP (10x10) 64-HTQFP (10x10) 64-HTQFP (10x10)

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